Tin plating

The tin is one of the commonly-used metallic materials that have been known from a long time ago. The hot-dip tin plating on iron plate is known with the name "tin plate" and the alloy with lead is the necessary material for solder and it has been used from a long time ago. The melting point of tin is low; 231.9℃ and it is a comparatively soft metal with a rich stretching property and it is rarely soluble in organic acids, so this plating has been used in many cases utilizing these characteristics. For the use method as the plating, these characteristics of bent membrane are also used. In recent years, the use for electronic components is activated accompanied with the rapid development of electronics, so it is widely used for the ceramic base substance and the plastic base substance including the metallic base substance due to the improvement of plating bath. On the other hand, in the use for electric components, there is a danger of whisker, which is the single crystal of whisker generated on the plating film, so various control measures are studied or made practicable. As the use of Pb has been prohibited in EU countries since July 1, 2006 by RoHS order of EU, the tin plating has been put on the review for chip parts and connector parts as Pb-free solder plating, which is an alternative to existing Su-Pb solder plating.